| Self Employment: |
|
| 12/2014-today |
Manager of Data Management Strategy / Big Data System Implementation Project (Marklogic)
at PRASA (Passenger Railways Agency of South Africa) & Customer Relationship
as a sub-contractor of EBCONT (IT company from Vienna, Austria)
|
Infineon Dresden: |
|
| 2013-11/2014 |
Technology Development and Transfer (200=>300mm) CoolMOS:
- Project Manager Technology Transfer (C6 600V) from Villach (Austria) to Dresden
- Project Manager Technology Transfer (C5-CP 600V) from KULIM (Malaysia) to Dresden
|
| 09/2010-2012 |
Project Manager Technology Transfer of 130nm Embedded Flash to Altis Semiconductor (France)
with Automotive Quality Requirements
|
| 2012 |
Infineon Dresden Coordinator Stealth Dicing with Backend Development (Regensburg)
of Embedded Magnet Sensor Project
|
| 2011-2012 |
Interim Project Manager Technology Development 130nm Embedded Magnet-Sensor
(from 10/2011 team member & backup of project manager)
|
| 2011 |
Manager Micro-Electrical Mechanics Integration (module owner isolated poly lamella) |
| 08/2008-08/2010 |
Technology Development 90nm Embedded Flash Automotive:
- Module Owner Process Integration of Gate & Spacer Module
- Responsible Process Integrator of SRAM Development and Optimization
- Defect Density Coordinator 90nm Team
|
Infineon USA: |
(Development Alliance with IBM, Freescale, Samsung, Toshiba, Chartered, AMD, Sony & Infineon |
| 2007-07/2008 |
45nm Technology Development:
- Project Manager of Process Integration of LPRG Technology of Alliance
|
| 12/2007 |
Promotion on Technical Ladder to 'Staff Engineer' |
| 2006 |
65nm Technology Development:
- Module Owner of Contact Module of Alliance
|
| 2005 |
65nm Technology Development:
- Infineon integration representative at 65nm Metallization Integration (MxVx module)
- Head of Via Yield Degradation Taskforce of 65nm Bulk Technology
|
Infineon Dresden: |
|
| 2004 |
130nm Embedded Flash Technology Development:
- Copper Metallization Overall Integration - Manager Process Integration
|
| 10/2004 |
Promotion on Technical Ladder to 'Senior Engineer' |
| 2002-2004 |
Process Integration Representative within 130nm Embedded Flash Technology Development Team |
| 2003 |
Copper Contamination Risk Assessment Team:
- Manager/Moderator of all Risk Assessment sessions (FMEA) for all departments in Dresden
|
| 2013-11/2014 |
Technology Development and Transfer (200=>300mm) CoolMOS:
- Project Manager Technology Transfer (C6 600V) from Villach (Austria) to Dresden
- Project Manager Technology Transfer (C5-CP 600V) from KULIM (Malaysia) to Dresden
|
| 09/2010-2012 |
Project Manager Technology Transfer of 130nm Embedded Flash to Altis Semiconductor (France)
with Automotive Quality Requirements
|
| 2012 |
Infineon Dresden Coordinator Stealth Dicing with Backend Development (Regensburg)
of Embedded Magnet Sensor Project
|
| 2011-2012 |
Interim Project Manager Technology Development 130nm Embedded Magnet-Sensor
(from 10/2011 team member & backup of project manager)
|
| 2011 |
Manager Micro-Electrical Mechanics Integration (module owner isolated poly lamella) |
| 08/2008-08/2010 |
Technology Development 90nm Embedded Flash Automotive:
- Module Owner Process Integration of Gate & Spacer Module
- Responsible Process Integrator of SRAM Development and Optimization
- Defect Density Coordinator 90nm Team
|
Infineon USA: |
(Development Alliance with IBM, Freescale, Samsung, Toshiba, Chartered, AMD, Sony & Infineon) |
| 2007-07/2008 |
45nm Technology Development:
- Project Manager of Process Integration of LPRG Technology of Alliance
|
| 12/2007 |
Promotion on Technical Ladder to 'Staff Engineer' |
| 2006 |
65nm Technology Development:
- Module Owner of Contact Module of Alliance
|
| 2005 |
65nm Technology Development:
- Infineon integration representative at 65nm Metallization Integration (MxVx module)
- Head of Via Yield Degradation Taskforce of 65nm Bulk Technology
|
Infineon Dresden: |
|
| 2004 |
130nm Embedded Flash Technology Development:
- Copper Metallization Overall Integration - Manager Process Integration
|
| 10/2004 |
Promotion on Technical Ladder to 'Senior Engineer' |
| 2002-2004 |
Process Integration Representative within 130nm Embedded Flash Technology Development Team |
| 2003 |
Copper Contamination Risk Assessment Team:
- Manager/Moderator of all Risk Assessment sessions (FMEA) for all departments in Dresden
|
| 2002-2003 |
220nm Embedded Flash Copper Metallization Development:
- Module Owner Dual-Damascene Copper
|
| 09/2000-2003 |
250/220nm Embedded Flash Manufacturing: Module Leader Aluminum Metallization;
QS9000 Coordinator Process Integartion Logic
|
| 2001 |
Project Manager C9N Technology Transfer from Infineon France to Dresden |
| 2001-2004 |
Head of several 8D & Focus Teams |
Freie Universitaet Berlin: |
(Physics Department, Group of Prof. Dr. Günter Kaindl) |
| 1997-05/2000 |
Independent scientific research on the electronic structure of lanthanide materials with x-ray emission and inverse photoemission spectroscopy |
| 1999 |
Collecting, analyzing and summarizing results to write and defend doctoral thesis (PhD in physics in 12/1999) |
| 1996-1997 |
Development of surface-sensitive electron-excited X-ray emission (world-wide for the first time)
(In close cooperation with Prof. Alexander Shulakow from St. Petersburg University) |
| |
|